October 2, 2022

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Insights on the Semiconductor Packaging World wide Market place to 2027 – Showcasing Amkor Technology, ASE Group and Chipbond Engineering Among Some others

Dublin, Jan. 15, 2021 (Globe NEWSWIRE) — The “Semiconductor Packaging – International Market Trajectory & Analytics” report has been included to ResearchAndMarkets.com’s giving.

The publisher provides yrs of investigation expertise to the 7th version of this report. The 290-web page report presents concise insights into how the pandemic has impacted creation and the purchase aspect for 2020 and 2021. A small-term phased restoration by vital geography is also resolved.

World Semiconductor Packaging Industry to Get to $41.8 Billion by 2027

Amid the COVID-19 disaster, the world-wide market place for Semiconductor Packaging believed at US$26.7 Billion in the year 2020, is projected to get to a revised dimension of US$41.8 Billion by 2027, rising at a CAGR of 6.6% over the assessment time period 2020-2027.

Natural substrates, a person of the segments analyzed in the report, is projected to record a 7.4% CAGR and reach US$22.3 Billion by the end of the examination period of time. Following an early analysis of the business enterprise implications of the pandemic and its induced economic disaster, development in the Lead frames phase is readjusted to a revised 6.3% CAGR for the next 7-12 months period.

The U.S. Industry is Believed at $7.2 Billion, While China is Forecast to Increase at 10.2% CAGR

The Semiconductor Packaging marketplace in the U.S. is believed at US$7.2 Billion in the year 2020. China, the world`s next premier financial system, is forecast to arrive at a projected market place size of US$9.1 Billion by the calendar year 2027 trailing a CAGR of 10.2% above the analysis interval 2020 to 2027. Amid the other noteworthy geographic markets are Japan and Canada, each individual forecast to increase at 3.5% and 6% respectively over the 2020-2027 period of time. In just Europe, Germany is forecast to increase at somewhere around 4.2% CAGR.

Bonding wires Phase to Report 5.8% CAGR

In the world wide Bonding wires section, United states, Canada, Japan, China and Europe will generate the 5.3% CAGR estimated for this phase. These regional marketplaces accounting for a combined market measurement of US$3 Billion in the year 2020 will get to a projected size of US$4.3 Billion by the near of the evaluation interval. China will continue being among the the speediest developing in this cluster of regional markets. Led by nations these types of as Australia, India, and South Korea, the current market in Asia-Pacific is forecast to attain US$5.7 Billion by the 12 months 2027, although Latin The us will grow at a 7% CAGR as a result of the investigation time period.

Competition determined in this sector incorporate, amongst some others:

  • Amkor Technological innovation, Inc.
  • ASE Group
  • Chipbond Technological innovation Corporation
  • ChipMOS Technologies, Inc.
  • Fujitsu Ltd.
  • Intel Corporation
  • Interconnect Methods, Inc.
  • Powertech Know-how, Inc.
  • Samsung Electronics Co., Ltd.
  • Siliconware Precision Industries Co., Ltd. (SPIL)
  • STATS ChipPAC Pte. Ltd.
  • Tianshui Huatian Technology Co., Ltd.
  • Unisem (M) Berhad
  • UTAC Holdings Ltd.

Crucial Topics Included:

I. INTRODUCTION, METHODOLOGY & REPORT SCOPE

II. Executive SUMMARY

1. Market OVERVIEW

  • World wide Competitor Current market Shares
  • Semiconductor Packaging Competitor Market Share State of affairs Around the globe (in %): 2019 & 2025
  • Effects of Covid-19 and a Looming World wide Recession

2. Target ON Choose Players

3. Marketplace Trends & Drivers

4. World-wide Current market Point of view

III. Marketplace Examination

IV. Opposition

  • Total Organizations Profiled: 41

For much more information and facts about this report go to https://www.researchandmarkets.com/r/ka847x


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