May 28, 2024

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Used Supplies Introduces New Technologies and Abilities for Accelerating the Semiconductor Industry’s Heterogeneous Integration Roadmap

Accelerating Heterogeneous Design and Integration

Heterogeneous integration brings new kinds of design and manufacturing flexibility to semiconductor and systems companies by allowing chips of various technologies, functions and sizes to be integrated in one package. Applied Materials is combining its leadership in process technology and large-area substrates along with ecosystem collaborations to accelerate the industry’s heterogeneous design and integration roadmaps.

Heterogeneous integration provides new kinds of layout and manufacturing overall flexibility to semiconductor and devices businesses by enabling chips of several technologies, capabilities and sizes to be built-in in one bundle. Utilized Products is combining its management in procedure know-how and big-location substrates together with ecosystem collaborations to speed up the industry’s heterogeneous style and integration roadmaps.

Heterogeneous integration brings new varieties of style and design and producing versatility to semiconductor and units corporations by enabling chips of many systems, functions and measurements to be built-in in a single bundle. Utilized Components is combining its management in course of action engineering and huge-space substrates alongside with ecosystem collaborations to speed up the industry’s heterogeneous layout and integration roadmaps.
  • New highly developed software package modeling and simulation for die-to-wafer hybrid bonding at Applied’s Sophisticated Packaging Growth Heart speeds customer time to sector

  • Enters into joint advancement agreement with EV Group for co-optimized wafer-to-wafer hybrid bonding methods

  • Enables much larger, bigger good quality substrates for superior packaging via the latest acquisition of Tango Devices, a leader in panel-stage processing

  • Presents consumer obtain to substantial-location generate administration remedies and other technologies from its Display company

SANTA CLARA, Calif., Sept. 08, 2021 (World NEWSWIRE) — Applied Products, Inc. now released new technologies and capabilities built to aid its clients accelerate their engineering roadmaps for heterogeneous chip design and integration.

Used is combining its leadership systems in advanced packaging and substantial-location substrates with industry collaborations to velocity the availability of options that supply simultaneous enhancements in electric power, overall performance, place, price and time to market place (PPACt™).

Heterogeneous integration delivers new sorts of structure and manufacturing overall flexibility to semiconductor and system corporations by enabling chips of a variety of technologies, capabilities and sizes to be integrated in one particular package deal. Applied is now the biggest provider of highly developed packaging systems with optimized products spanning etch, bodily vapor deposition (PVD), chemical vapor deposition (CVD), electroplating, floor treatments and annealing. Applied’s Superior Packaging Advancement Middle in Singapore properties the industry’s broadest portfolio of solutions that enable the foundational constructing blocks of heterogeneous integration, including innovative bump and micro-bump, high-quality-line redistribution layer (RDL), TSV and hybrid bonding.

“Applied’s field-foremost portfolio of highly developed packaging answers gives buyers the broadest assortment of enabling technologies for heterogenous integration,” mentioned Nirmalya Maity, Corporate Vice President of Sophisticated Packaging at Utilized Elements. “Through technological innovation co-optimization and collaboration with other folks in the field, we are building an ecosystem that can accelerate our customers’ PPACt roadmaps and generate enjoyable new growth possibilities for Utilized.”

Right now, Applied is unveiling innovations in a few parts significant to state-of-the-art packaging for heterogeneous integration: die-to-wafer hybrid bonding, wafer-to-wafer bonding and superior substrates.

Accelerating Die-to-Wafer Hybrid Bonding
Die-to-wafer hybrid bonding takes advantage of direct, copper-to-copper interconnects to boost I/O density and shorten the wiring length between chiplets to enhance overall functionality, power and price tag. To speed up growth of this technological innovation, Applied is including sophisticated computer software modeling and simulation to its Innovative Packaging Improvement Heart. These capabilities allow numerous parameters this sort of as content assortment and packaging architecture to be evaluated and optimized prior to hardware advancement to considerably accelerate discovering cycles and speed time to industry for buyers. This builds upon the joint growth arrangement announced in Oct 2020 involving Utilized and BE Semiconductor Industries N.V. (Besi) to create the industry’s to start with total and tested products answer for die-based hybrid bonding.

“Our joint progress system with Used Components has significantly improved our blended knowledge of the co-optimized gear answers needed for consumers to utilize advanced hybrid bonding procedures in wafer amount generation environments,” reported Ruurd Boomsma, Besi’s Main Technological innovation Officer. “In a quite small time, the Besi and Utilized groups have built superb development operating with each other at the Hybrid Bonding Center of Excellence in Singapore to course of action purchaser supplies and accelerate enhancement of superior heterogeneous integration technologies.”

Producing Co-optimized Remedies for Wafer-to-Wafer Hybrid Bonding
Wafer-to-wafer bonding permits chipmakers to establish particular chip buildings on 1 wafer and other folks on a 2nd wafer and then bond the wafers to develop comprehensive products. In order to attain higher general performance and generate, the good quality of the entrance-conclude processing ways is important as
is the precise uniformity and alignment of the wafers as they are being bonded. Applied nowadays announced a joint improvement arrangement with EV Group (EVG) to create co-optimized methods for wafer-to-wafer bonding. The collaboration delivers jointly Applied’s semiconductor process knowledge in deposition, planarization, implant, metrology and inspection with EVG’s leadership in wafer bonding, wafer pre-procedure and activation, as effectively as alignment and bond overlay metrology.

“Semiconductor innovation is significantly getting fueled by 3D integration and engineered materials, which drives increased demand for wafer-to-wafer hybrid bonding. Optimizing this vital procedure for new purposes calls for an in-depth being familiar with of integration issues both equally up and down the course of action chain,” stated Dr. Thomas Uhrmann, Enterprise Improvement Director at EVG. “Industry collaborations like the 1 that we have with Applied Resources allow us to share knowledge and study from unique places of toughness between method machines providers, which enables us to co-enhance our remedies and improved remedy our customers’ rising and important producing worries.”

“Through collaborations with market companions together with Besi and EVG, Used Materials is offering our buyers the capabilities and experience they need to have to speed up improvement and adoption of hybrid bonding systems, both die-to-wafer and wafer-to-wafer,” claimed Vincent DiCaprio, Handling Director of Company Development for Highly developed Packaging at Used Resources. “Applied appears to be like forward to building additional engagements in the ecosystem as chipmakers significantly use heterogeneous structure tactics to push their PPACt roadmaps.”

Larger sized, Far more Highly developed Substrates Provide PPAC Positive aspects
The require for extra highly developed substrates is raising as chipmakers squeeze better numbers of chips into complex 2.5D and 3D package deal patterns. To help more substantial bundle dimensions with better interconnect density, Utilized is employing condition-of-the-art panel-level processing technology from its the latest acquisition of Tango Systems. Panel-dimension substrates, which can evaluate 500mm x 500mm or much larger, can accommodate a larger number of offers when compared to wafer-dimensions formats, therefore providing a price benefit in addition to greater power, performance and place.

As its customers adopt these larger sized panel measurements, Utilized is furnishing them with access to big-location resources engineering technologies from its Display screen Group, which include deposition, eBeam testing, SEM assessment and metrology, and centered ion beam for defect evaluation.

Extra particulars on Applied’s packaging technologies will be discussed at the company’s 2021 ICAPS and Packaging Learn Class becoming held today.

About Used Elements
Used Products, Inc. (Nasdaq: AMAT) is the leader in elements engineering answers made use of to make almost each individual new chip and advanced show in the environment. Our abilities in modifying supplies at atomic ranges and on an industrial scale permits consumers to rework prospects into reality. At Used Resources, our improvements make achievable a improved upcoming. Discover a lot more at www.appliedmaterials.com.

A image accompanying this announcement is offered at https://www.globenewswire.com/NewsRoom/AttachmentNg/15b9874b-cdab-4956-bbc5-advertisement9c59fc0f4c

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